S = SLC + Single die + Small blockA = SLC + Double die + Small blockB = SLC + Quadrupple die + Small blockF = SLC + Single die + Large blockG = SLC + Double die + Large blockH = SLC + Quadruple die + Large blockK = SLC + DSP + Large blockT = MLC + Single die + Large blockU = MLC + Double die + Large blockV = MLC + Quadruple die + Large blockW = MLC + DSP + Large block
A = WaferP = Lead freeL = LeadedR = Lead & Halogen free
X
Bad Block
B = Included bad blockS = 1~5 bad block includedP = All good block
X
Operation Temperature
C = Commercial (0°C to 70°C)E = Extended (-25°C to 85°C)M = Mobile (-30°C to 85°C)I = Industrial (-40°C to 85°C)
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.